Process to Allow Electrical and Mechanical Connection of an Electrical Device with a Face Equipped with Contact Pads

ABSTRACT

A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device is presented. The electrical device includes a face equipped with contact pads. The method includes applying an adhesive layer on the face equipped with contact pads. The adhesive layer is composed of a substance with adhesive properties. The method further includes creating a plurality of openings through the adhesive layer over each contact pad, and growing electrolessly or electrochemically, small metal sticks in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.

RELATED APPLICATIONS

This application is a division of application Ser. No. 10/485,693 filedon Feb. 3, 2004, which is a U.S. national stage of InternationalApplication No. PCT/IB02/03041 filed on Aug. 2, 2002, which claimspriority from French Patent Application No. 01/10483 filed on Aug. 3,2001. The entire content of application Ser. No. 10/485,693 isincorporated herein by reference.

FIELD OF THE INVENTION

This invention concerns the electrical and mechanical connection of anelectrical device with another electrical device. Both could be forexample a wafer, an integrated circuit or even just a component. Thisinvention applies especially to the field of integrated circuitsprotection and in particular in the field of memory cards.

BACKGROUND OF THE INVENTION

A connection process is based on the use of a film called ACF(Anisotropic Conductor Film). This type of film contains conductingelements extending through the film thickness. According to a firststage, the film is made separately onto a neutral support. According toa second stage, the film is finely recovered using sub-engraving.According to a third stage, the film is pasted with glue on each face toapply it then onto a first component. A last stage consists inconnecting a second component onto the part of the film that is not yetcovered. Finally, both components are fixed mechanically through theglue pasted on both faces of the film, and electrically using the metalelements enclosed in the film.

U.S. Pat. No. 6,256,874 describes a method for connecting two conductivelayers in an electronic circuit package comprising the steps of formingdentrites on selected regions of a first conductive layer, formingdentrites on selected regions of a second conductive layer. Dentritesare formed by means of a photoresist material to the area of a firstsurface metal and then expose and develop the resist byphotolithographic techniques to provide an exposed area on whichdentrites are to be formed. The photoresist is then removed. The methodfurther comprises the step of applying an epoxy adhesive material overthe first conductive layer, and compressively attaching the secondconductive layer to the first conductive layer such that the dentriteson the first conductive layer contact the dentrites on the secondconductive layer.

SUMMARY OF THE INVENTION

An object of the invention is to reduce the costs.

According to one aspect of the invention a method of manufacturing anelectrical device that is electrically and mechanically connectable toanother electrical device, the electrical device having a face equippedwith contact pads, the method being characterized in that it includes:

a layer-application step in which an adhesive layer is applied on theface equipped with contact pads, the adhesive layer being composed of asubstance with adhesive properties;

an opening-creation step in which an opening is created through theadhesive layer at the level of a contact pad;

an opening-filling step in which the opening is filled with a conductivematerial so that the opening is substantially filled with the conductivematerial so as to form a conductive path the volume of which is definedby the opening.

The adhesive layer is, as it were, used as a mould to form theconductive path. Consequently there is no need for a specificphotoresist layer as in U.S. Pat. No. 6,256,874. The invention thusallows a reduction of the costs.

BRIEF DESCRIPTION OF THE DRAWINGS

This invention shall be better grasped after reading the followingnon-limiting description, written by reference to the attached drawings,where:

FIG. 1 shows as a cross-section, a plate which is a starting point forthe invention process;

FIG. 2 shows as a cross-section, a fixing organic layer applied to theplate according to a first stage in the process subject of theinvention;

FIG. 3 shows as a cross-section, a fixing organic layer that has beenstructured according to a second stage in the process subject of theinvention;

FIG. 4 shows the stage in the process according to the invention inwhich the fixing layer is equipped with small metal sticks;

FIG. 5 shows, as a horizontal projection and as a cross-section, part ofa plate;

FIG. 6 shows the beginning of the fixing stage according to theinvention process;

FIG. 7 shows, as a cross-section, the plates after the stage of fixingby thermo-compression;

FIG. 8 shows, as a cross-section, the first-plate tapering.

DETAILED DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a starting point in the process according to the invention.It shows a plate 0 including a silicium chip 1 on which are arrangedcircuits 2. A passivation layer 3 is superimposed on the layer includingcircuits 2. In this passivation layer 3 there are contact pads 4inserted with the purpose to arrange interconnection with additionalcircuit.

FIG. 2 shows the first stage in the process, actually a stage of layingdown an organic layer 5 with sticking characteristics. This organiclayer 5 is superimposed on the passivation layer 3 including contactpads 4. This organic layer is for instance laid in the form of asolution obtained by centrifuging. The gaps 6 in the organic layer 5show where organic matter has been removed from the organic layer 5.

After a drying stage, and as shown by FIG. 3, organic matter in theorganic layer 5 is removed partially or completely to produce the gap 6,and this is in particular at the level of the contact pads 4. Thisorganic matter removal may be achieved for instance by etching. If theorganic matter is photosensitive, it may be also exposed, after applyinga masker, to rays and in particular to UV rays. The parts of organicmatter exposed are finally dissolved using a chemical bath. The organiclayer 5 so modified is said to be formed into a structure.

FIG. 4 shows the following stage which is a stage of growth for smallmetal sticks 7 in the areas where the organic matter has been removed.This metal stick growth is achieved for instance in chemical baths usingelectroless or electrochemistry. The small metal sticks 7 are directedpreferably perpendicular to the contact pad surface 4 and are insulatedfrom each other by the organic matter in layer 5. Although FIG. 4suggests the existence of small metal sticks 7 at the level of thecontact pads 4, this does not exclude the possibility to also grow somein other areas.

The following stage, as shown on FIG. 6, is a stage to align a secondplate 0′ of the same type as plate 0 on the first plate 0 so that thecontact pads 4 and 4′ face each other. This second plate may includecircuits 2′ necessary for the operation of circuits 2.

In a later stage, as described in FIG. 7, both plates 0 and 0′ arefixed, for example, using thermo-compression. Ultrasound techniques mayalso be used advantageously.

Plate 0′ includes media 8 so as to allow the electrical contacts 4 toexit to the outside by means, for instance, of the wiring cable 9 as canbe seen on FIG. 7.

FIG. 8 shows that it is possible to proceed next to the plate 0 taperingat the level of its lower face 1″ in order, for instance, to enable apossible slip sheet inserting into a card body or so as to increase thedifficulty in separating circuits for safety.

Of course, the description of the invention embodiment as given above isnot limiting for the invention which must be understood broadly.

In particular, the subject of this invention may apply not only to thefield of mechanical and electrical connections at the level of acomponent or an integrated circuit, but also at the level of any otherelectrical device with a face equipped with contact pads. It may be inparticular a question of wafers of any size, for example with a diameterof 150 mm and comprising approximately one thousand components.

Regarding the organic layer 5, any material preferably with stickingcharacteristics, may be used. This may be in particular polyimides,photosensitive resins or thermoplastics. These materials also have theadvantage of stimulating the growth of metal compounds.

The use of thermoplastics is interesting since it will be possible toseparate without damage the two electrical elements. On the other hand,the polyimides will be used with an advantage whenever it is intended tomake difficult the separation of the two components without physicaldamage. This is particularly interesting in the field of memory cardsregarding physical security.

The small metal sticks 7 may be more generally metal compounds, forexample compounds with nickel, palladium or copper.

Preferably, as can be seen on FIG. 5, several small metal sticks 7 canbe grown per contact area 4, typically about ten. This allows relativelygood quality electrical contacts. The metal small sticks diameter isbetween, for example, 10 and 30 μm.

The metal contact structure (4,7,4′) according to this invention avoidswhat is called contact recovery. This is because on the market wafers,localised oxidation patches often exist on contact pads, that aregenerally in aluminium. The contact recovery consists in cleaning thesecontact pads to remove the oxidation so as to have good qualityelectrical connections. However the contact structure according to thisinvention (4,7,4′), especially because of the number and the reducedsize of the cross-section of small metal sticks 7 in relation to thesize of the oxidation patches, enables eliminating this stage calledcontact recovery.

Let us assume for instance that, at the level of a certain contact pad,there are 25 metal small sticks. Let us assume also that there is anoxidation patch that prevents 10 of these 25 small sticks to be incontact with the contact pad. In this case, there remains 15 metal smallsticks in contact and ensuring however a rather good electricalconnection between the electrical devices.

In the case, in particular, of fixing by thermo-compression, it isbetter if the conductive paths 7 shown on FIG. 7 have a length higherthan the organic layer thickness 5, so that when fixing, there is a goodinterpenetration of these paths in the metal of the contact pads 4′ ofthe second plate 0′. Generally, these pads are in aluminum and are about1 μm thick.

Also other modes of embodiment are likely to give results that areparticularly interesting.

At the interface fixing level (5,7), several layers of compositematerials may be used. An intermediary layer may be used to rearrangethe contact areas 4 on the interface (5,7). Further to structuring afirst organic layer, metal tracks may be created by deposition. A secondstructured organic layer may again be used for the growth of metalliccompounds.

Several layers analogous to the organic layer 5 may be used in this way,either to create conducting media, or to create metal tracks. The laststage remains the stage of the electrical and mechanical connection withthe second electrical device.

Several layers, analogous to the organic layer 5, may also be used. toimprove the security and the complexity of the interface. A multi-layermay also improve the quality of fixing via a better planishing of thecircuit surface or a look for a better chemical reactivity.

After the growth of metal small sticks in the organic layer 5 which actsas the fixing layer, the plate may be divided into smaller electricalentities, for instance integrated circuits or components. Theseelectrical entities may then be mounted using the technique called Flipchip. The material in the organic layer is used as the sticking agent onthe support. It is thus possible to get connections in the order of 10μm instead of the 40 to 60 μm obtained using the flip chip technique.This reduction in the connection size is especially advantageous in thefield of high frequencies.

1. An electrical assembly, comprising: a first electrical device and asecond electrical device, the first electrical device and the secondelectrical device electrically connected to each other by means of aconnection layer comprising a substance with adhesive properties and atleast one conductive path formed by at least one opening that extendsthrough the connection layer and is filled with a conductive material.2. The electrical assembly according to claim 1, wherein the connectionlayer comprises one of polyimides, photosensitive resins, andthermoplastics.
 3. The electrical assembly according to claim 1, whereinthe at least one opening is a plurality of openings and the at least oneconductive path is a plurality of conductive paths formed by theplurality of openings that extend through the connection layer and arefilled with the conductive material.
 4. The electrical assemblyaccording to claim 3, wherein the conductive paths are metal sticks, andthe metal sticks are insulated from each other by the substance.
 5. Theelectrical assembly according to claim 4, wherein the metal stickscomprise at least one of nickel, palladium, and copper.
 6. Theelectrical assembly according to claim 3, wherein first electricaldevice includes a first face including a plurality of first contact padsand the second electrical device includes a second face including aplurality of second contact pads, the plurality of first contact padsface the plurality of second contact pads, and two or more of theconductive paths of the plurality of the conductive paths are over eachcontact pad.
 7. The electrical assembly according to claim 6, whereinthe plurality of conductive paths are perpendicular to the plurality offirst and second contact pads.
 8. The electrical assembly according toclaim 6, wherein the first electrical device includes a firstpassivation layer, the second electrical device includes a secondpassivation layer, the plurality of first contact pads are in the firstpassivation layer, the plurality of second contact pads are in thesecond passivation layer, and the connection layer is superimposed onthe first and second passivation layers.
 9. The electrical assemblyaccording to claim 6, wherein one of the first and second first andsecond electrical devices includes media including an exit for a wiringcable connected to the first and second contact pads.
 10. The electricalassembly according to claim 3, wherein a diameter of the plurality ofconductive paths is between 10 and 30 μm.
 11. The electrical assemblyaccording to claim 3, wherein the plurality of conductive paths have avertical length higher than a vertical thickness of the substance of theconnection layer.
 12. The electrical assembly according to claim 3,wherein the first electrical device includes a first plate, the secondelectrical device includes a second plate, and one of the first andsecond plates has a smaller thickness than the other of the first andsecond plates.
 13. The electrical assembly according to claim 1, whereinthe connection layer comprises a plurality of layers.